Kinetis K series MCUs target a wide range of low-power, processing-efficient embedded applications, including: wearables, gaming, IoT data concentrators and end nodes, point-of-sale systems, smart-grid infrastructure, home automation products, and factory automation systems.
Freescale Semiconductor has introduced thinner version of the Kinetis K22 microcontroller (MCU), integrating 120 MHz of performance and an array of memories and interfaces into a package measuring 0.34 millimeters in height. The device is ideal for applications such as chip-and-PIN credit cards, wearables and consumer electronics, where security and small form factors are essential.
Freescale plans to deploy this ultra-thin packaging technology across a broad spectrum of its Kinetis MCU portfolio, with multiple products planned for release in the months ahead.
“In the IoT era, an incessant demand for ’what’s next’ is challenging systems designers to consistently deliver breakthrough solutions,” said Steve Tateosian, manager of microcontroller platforms for Freescale.
Decreasing the size – and now height – of a MCU presents systems designers with exciting possibilities, including new use cases for innovative applications. For example, Freescale’s new MCU could enable new products that monitor a diabetic’s glucose levels when adhered to the skin in the form of a stretchable electronic patch, or even under the skin as an implant.
Kinetis K series MCUs target a wide range of low-power, processing-efficient embedded applications, including: wearables, gaming, IoT data concentrators and end nodes, point-of-sale systems, smart-grid infrastructure, home automation products, and factory automation systems.