Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies, has partnered with US-based BroadPak Corporation to develop advanced semiconductor packaging capabilities in India. The collaboration aims to establish an outsourced semiconductor assembly and test (OSAT) facility focused on 2.5D/3D packaging, chiplet integration and other advanced packaging technologies.
The proposed facility will bring together Paras Semiconductors’ manufacturing plans in optoelectronics and photonics with BroadPak’s expertise in semiconductor packaging, heterogeneous integration and multi-die architectures.
The companies plan to develop capabilities across hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and semiconductor testing and qualification. The facility is also expected to cater to applications in high-performance computing (HPC), networking and data centres.
Focus on 2.5D/3D packaging and chiplet integration
Under the partnership, Paras Semiconductors will gain access to BroadPak’s technology intellectual property, design and manufacturing expertise, along with process know-how and technology transfer in 2.5D/3D packaging and chiplet integration.
The companies will also explore the joint development of advanced packaging platforms for AI and high-performance computing applications. The collaboration includes plans for training and skill development for Indian engineers.
Advanced packaging enables multiple semiconductor dies, memory and processing components to be integrated within a single package. Technologies such as 2.5D/3D integration and chiplets allow manufacturers to combine different components to improve performance, connectivity and power efficiency without relying solely on increasingly complex single-chip designs.
The planned facility will include capabilities in wafer-level processing, hybrid bonding, through-silicon vias (TSVs), micro-bumping, advanced interposers and redistribution layer (RDL) technologies. It will also focus on thermal management, co-packaged optics and reliability testing.
AI and data centre demand drives advanced packaging
Advanced packaging is gaining importance as demand for AI accelerators, graphics processing units (GPUs) and high-bandwidth memory increases. These applications require higher data transfer speeds, computing performance and power efficiency, placing greater emphasis on how semiconductor components are integrated and connected.
The partnership will explore packaging solutions for AI and HPC systems, alongside applications in optical and optoelectronic systems. Co-packaged optics, which brings optical components closer to semiconductor processing units, is another area included in the proposed facility’s capabilities.
Paras expands presence in semiconductor manufacturing
The partnership marks Paras Defence’s expansion into advanced semiconductor packaging, building on its existing presence in optics, optronics and critical electronics.
Munjal Sharad Shah, Managing Director of Paras Defence & Space Technologies, said the company aims to develop packaging capabilities that can serve domestic strategic electronics requirements as well as the wider semiconductor industry.
BroadPak, headquartered in San Jose, California, specialises in advanced packaging design, manufacturing and system integration. Its areas of expertise include heterogeneous integration, multi-die architectures, high-speed interconnects, thermal management and co-packaged optics.
For India, the proposed facility would add capabilities in the packaging and integration segment of the semiconductor value chain. While semiconductor design and wafer fabrication are important parts of chip manufacturing, assembly, packaging and testing are also required to turn fabricated dies into functional semiconductor products.