Vertiv has completed what it describes as India’s first direct-to-chip high-density liquid cooling (HDLC) deployment at CapitaLand India Trust’s CLDC Mumbai 01 data centre in Airoli, Navi Mumbai. The project uses Vertiv’s secondary fluid network (SFN) system to support 30 MW of AI workloads for a hyperscale end customer.
The deployment marks a step in the adoption of liquid cooling in India as data centre operators prepare for the higher thermal demands of AI workloads. Traditional air-cooling systems face increasing challenges as computing density rises, prompting operators to consider liquid-based approaches for high-density infrastructure.
Vertiv’s closed-loop SFN system transports coolant from a facility’s cooling infrastructure to the chip level. The system is manufactured, tested and commissioned to meet operational requirements before supporting live IT loads.
“The CapitaLand Investment project, particularly the collaboration, helped us accelerate the development of our manufacturing and engineering capabilities, enabling us to support the growing demands of AI-ready digital infrastructure,” said Subhasis Majumdar, managing director, Vertiv India.
“As the Indian market advances towards high-density liquid cooling for hyperscale and data centre applications, we see meaningful growth potential and are well positioned to deliver the scale, expertise, and innovation required for these deployments,” he added.
Building capabilities for high-density cooling
To support the project’s scale and future deployments, Vertiv developed a production facility capable of manufacturing customised technology loop skids in larger volumes. The facility was designed to meet stringent requirements for protecting sensitive cooling components from contamination.
Vertiv worked with CapitaLand Investment, the owner and operator of CLDC Mumbai, to develop installation and commissioning procedures intended to minimise dust ingress into the technology loop during the installation of the SFN skids.
After commissioning, Vertiv demonstrated technology-loop balancing using its SFN-Tab kits. The company also conducted Level 4 (L4) testing at the data centre to validate system performance ahead of go-live.
The project builds on the relationship between Vertiv and CapitaLand Investment, with both companies working together from design through commissioning. It also strengthens Vertiv India’s engineering and manufacturing capabilities for large-scale liquid cooling deployments.
Liquid cooling gains relevance as AI workloads grow
The deployment comes as data centre operators look for cooling infrastructure capable of supporting increasingly dense AI computing environments. Liquid cooling brings coolant closer to heat-generating components, helping address thermal management requirements that become more demanding as computing density increases.
Vertiv said the project demonstrates its capabilities in developing infrastructure for large-scale AI deployments and positions its India operations to support further adoption of high-density liquid cooling.
Vertiv provides power, cooling, IT infrastructure and services for data centres, communication networks and commercial and industrial facilities. Headquartered in Westerville, Ohio, the company operates in more than 130 countries.