India Approves ₹5,500 Crore Projects to Boost Domestic Electronics Component Manufacturing

Union Electronics and IT Minister Ashwini Vaishnaw announced that the approved projects mark a major milestone in India’s transition from assembling finished products to producing key electronic components, materials, and modules domestically. The approved units, spread across Tamil Nadu (5), Andhra Pradesh (1), and Madhya Pradesh (1), reinforce balanced regional growth and expand high-tech manufacturing beyond metro areas.

The projects will enable India to meet 100% of its Copper Clad Laminate demand, 20% of Printed Circuit Board (PCB) demand, and 15% of Camera Module sub-assembly demand domestically, with 60% of total production earmarked for exports.

The approved projects will cover critical components including High-Density Interconnect (HDI) PCBs, Multi-Layer PCBs, Camera Modules, Copper Clad Laminates, and Polypropylene Films — essential for use in smartphones, laptops, automotive systems, telecom, renewable energy, and defence applications.

This marks India’s strong entry into base material manufacturing, with the country establishing its first Copper Clad Laminate facility and Polypropylene Film manufacturing for capacitors used in a wide range of industries.

The ECMS has received overwhelming interest with 249 applications representing a potential investment of ₹1.15 lakh crore and production worth ₹10.34 lakh crore, alongside an estimated 1.42 lakh jobs.

These initiatives will reduce import dependence, create high-skill employment, and strengthen trusted supply chains for critical sectors. Together with the Production Linked Incentive (PLI) Scheme and India Semiconductor Mission (ISM), ECMS completes the nation’s electronics value chain — from devices to chips, and from components to materials and innovation.